Amtest - no. 1 SMT distributor in Central and Eastern Europe

Latest news

  • 20/11/2017

    ESE Printer Company joins the Amtest Group family

    Productronica trade show so the co-operation agreement between ESE and Amtest. See more details

  • 13/11/2017

    Congratulations

    Congratulations to Grzegorz Kopczyński, our team member on completing the Athens Marathon. See more details

  • 02/11/2017

    Branislav Ružička joins Group

    With pleasure we announce that Branislav Ružička has become part of the Amtest Group – working with our Sales Operation in the Slovak Republic. See more details

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Wire Bonding

F+K Delvotec

German leader in the wire bonding process.

Specialists for assembly and joining technologies who are committed to continuing to develop reliable and efficient products and solutions for connecting electronic components since they were founded in 1978.

In the field of wire bonding for customers in the semiconductor, E-Mobility, Photo-Voltaic and automotive industries F&K Delvotec developed complete solutions for partial or full automation. The all-round service ranges from applications guidance in the selection and configuration of the wire bonding machines through to coupling of buffer stations and magazines as well as the integration of feeding systems.

Wire Bonder G5 Single – the first and only fully automatic all-in-one bonder in the world

The compact, space saving Wire Bonder G5 is a veritable multi-talent. It can be converted to any current wire bond process in a very short time.



Wire Bonder G5-2 – the first and only wire bonder with two heads on a single chassis

Wire Bonder G5-XL – the first wire bonder with a working area of almost one square metre

Laser Bonder – Raising the curtain on a completely new technology


With the world premier of their laser bonder in 2015, F&K Delvotec GmbH underlined once again the validity of its motto: Staying ahead in Bonding Technology.

The completely new process, based on laser micro-welding, is particularly suitable for joining ribbon as well as bonding wire onto battery terminals and onto DCB substrates and copper terminals in power electronics modules. With laser bonding the application of ribbon bonding for much higher currents is accomplished.