Amtest - no. 1 SMT distributor in Central and Eastern Europe

Latest news

  • 01/05/2018

    Amtest Group enters Serbian market

    Amtest is pleased to announce that the Group has entered the market of Serbia, along with our selected partners that will include the global leading Nordson group of companies, Nordson Asymtek, Nordson March and Nordson Select. See more details

  • 01/04/2018

    Amtest Group further expands our service team – this time in Hungary

    Amtest is pleased to welcome Ferenc Szabo to our service team – working primarily within Hungary. See more details

  • 23/02/2018

    Amtest Group and Universal Instruments extend partnership into Bulgaria

    Universal Instruments of Binghamton USA, the world leader in its through-hole lineup, has extended its co-operation with Amtest Group to now cover the territory of Bulgaria. See more details

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Wire Bonding

F+K Delvotec

German leader in the wire bonding process.

Specialists for assembly and joining technologies who are committed to continuing to develop reliable and efficient products and solutions for connecting electronic components since they were founded in 1978.

In the field of wire bonding for customers in the semiconductor, E-Mobility, Photo-Voltaic and automotive industries F&K Delvotec developed complete solutions for partial or full automation. The all-round service ranges from applications guidance in the selection and configuration of the wire bonding machines through to coupling of buffer stations and magazines as well as the integration of feeding systems.

Wire Bonder G5 Single – the first and only fully automatic all-in-one bonder in the world

The compact, space saving Wire Bonder G5 is a veritable multi-talent. It can be converted to any current wire bond process in a very short time.



Wire Bonder G5-2 – the first and only wire bonder with two heads on a single chassis

Wire Bonder G5-XL – the first wire bonder with a working area of almost one square metre

Laser Bonder – Raising the curtain on a completely new technology


With the world premier of their laser bonder in 2015, F&K Delvotec GmbH underlined once again the validity of its motto: Staying ahead in Bonding Technology.

The completely new process, based on laser micro-welding, is particularly suitable for joining ribbon as well as bonding wire onto battery terminals and onto DCB substrates and copper terminals in power electronics modules. With laser bonding the application of ribbon bonding for much higher currents is accomplished.